Our wide range of capabilities in plating and heat treatments is perfect for TLP diffusion bonding. The preferred system is silver-tin, although other systems (silver-bismuth based) can offer bonding at lower temperatures.
Our electroplating is complemented by our capabilities in electroforming; in copper and nickel base systems – combined with our state of the art capabilities for plating waxes and soluble plastics or low melting point alloys, allowing us to fabricate complex metallic shells in geometries not possible with other routes. Electroformed shells have low residual stress and are hermetic and are suitable for vacuum applications and for producing low cost moulds.
Yttria, Zirconia, Lanthania.
Sulphuric hard anodizing (including sealing), Die processes for colour.